CSPPT

Features:

• 8,16 or 32 integrated high frequency bussed terminations
• Ultra small footprint Chip Scale Package
• Ceramic substrate
• 0.35mm Eutectic Solder Bumps, 0.65mm pitch


Application

• Parallel resistive bus termination
• Bussed resistor array


Description

The CSPPT is a high performance Integrated Passive Device (IPD) which provides parallel terminations suitable for use in high speed bus applications. Eight (8), sixteen (16), or thirty-two (32) parallel termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%.

CSPPT Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards without the use of underfill.