CSPESD303

Features:

• 1, 2 or 3 channels of ESD protection
• ±15kV ESD protection (IEC 61000-4-2, contact discharge)
• ±30kV ESD protection (HBM)
• Supports both AC and DC signal applications
• Low leakage current (<100nA)
• Chip Scale Package features extremely low lead inductance for optimum ESD and filter performance
• 4 bump, 1.06 x 0.93mm footprint Chip Scale Package (CSP)
• Lead-free version available


Application

• I/O port protection
• EMI filtering for data ports
• Cellphones, notebook computers, PDAs
• Wireless Handsets
• MP3 Players
• Digital Still Cameras
• Handheld PCs


Specifications

PARAMETER	RATING	UNITS
Storage Temperature Range	-65 to +150	°C
DC Package Power Rating	200	mW

Description

The CSPESD301/302/303 is a family of 1, 2, and 3- channel ESD protection arrays, which integrate two, three and four identical avalanche-style diodes. It is intended that one of these diodes is connected to GND and the other diodes provide ESD protection for up to 3 lines depending upon the configuration utilized. The back-to-back diode connections provide ESD protection for nodes that have AC signals up to 5.9V peak. CSPESD303 provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes are designed and characterized to safely dissipate ESD strikes of ±15kV, well beyond the maximum requirements of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, these devices protection against contact discharges at greater than ±30kV. The diodes also provide some EMI filtering, when used in combination with a PCB trace or series resistor.

CSPESD303 are particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments.

The CSPESD301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing.