CSPEMI607

Features:

· Four channels of EMI filtering
· Four channels of ESD Protection
· ±15kV ESD protection (IEC 61000-4-2, contact discharge)
· ±30kV ESD protection (HBM)
· Better than 30dB of attenuation at 1GHz for 15pF- 100W-15pF filter configuration
· Chip scale packaging features extremely low lead inductance for optimum filter and ESD performance




Application

· LCD data lines in mobile handsets
· I/O port protection for mobile handsets, notebook computers, PDAs etc.
· EMI filtering for data ports in cell phones, PDAs or notebook computers.




Specifications

• Four channels of EMI filtering
• Four channels of ESD Protection
• ±15kV ESD protection
• (IEC 61000-4-2, contact discharge)
• ±30kV ESD protection (HBM)
• Better than 30dB of attenuation at 1GHz for 15pF-100-15pF filter configuration
• Chip scale packaging features extremely low lead inductance for optimum filter and ESD performance

Description

CAMD's CSPEMI607 is an EMI filter array with ESD protection, which integrates four Pi- filters (C-RC) and 4 channels of ESD protection. The CSPEMI607 has component values of 15pF-100W-15pF ). The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD).

The ESD diodes CSPEMI607 connected to the filter ports and the standalone ESD diode channels are designed and characterized to safely dissipate ESD strikes of ±15kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV.

CSPEMI607 is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI607 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in mobile handsets. The CSPEMI607 is available in a space-saving, low-profile, chip-scale package, and is fabricated with one of California Micro Devices' semiconductor processes.