CSD-20H-0.9G

      The CSD-20H-0.9G has the following features including 0.8 - 1.0 GHz;LOWEST LOSS;HIGHEST ISOLATION;BEST PHASE/AMPLITUDE BALANCE;SURFACE MOUNT;TAPE & REEL.
      The Multi-Mix® CSD series CSD-20H-0.9G provides directional couplers with low insertion loss, low VSWR, and high directivity. Precise coupling and frequency sensitivity make them ideal for applications power amplifiers, signal distribution and processing. CSD directional couplers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.The CSD series CSD-20H-0.9G is an easy to install SMD designed specifically for the full spectrum of wireless applications.The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.Additional benefits include:Available on tape and reel;Cost effective for commercial wireless applications;Industry standard size;Temperature stable from 65 to +125 degrees C.;Can be integrated with other Multi-Mix® components in a multi-function module.
      All CSD series CSD-20H-0.9G components are 100% tested. The product family has passed environmental screening per MIL-STD-202 including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (1000 cycles).Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure with superior performance at microwave and millimeter wave frequencies. The bonded multilayers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and plated- through vias to form a SMD module that requires no additional packaging and is ready for pick and place.The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics.
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