Features: CPU Features
·Fully static RISC processor core, capable of operating from 0 to 24 MHz with zero wait/hold states
·Minimum 41.7 ns instruction cycle time with a 24-MHz internal clock frequency, based on a 12-MHz external input
·47 independently vectored peripheral interrupts
On-Chip Memory
·256K bytes reprogrammable Flash program memory
·8K bytes Flash data memory
·32K bytes of static RAM data memory
·Addresses up to 12M bytes of external memory
Broad Range of Hardware Communications Peripherals
·Bluetooth Lower Link Controller (LLC) including a shared 4.5K byte Bluetooth RAM and 1K byte Bluetooth Sequencer RAM
·ACCESS.bus serial bus (compatible with Philips I2C bus)
·Dual CAN interface with 15 message buffers conforming to CAN specification 2.0B active
·8/16-bit SPI, Microwire/Plus serial interface
·Four-channel Universal Asynchronous Receiver/Transmitter (UART), one channel has USART capability
·Advanced Audio Interface (AAI) to connect to external 8/ 13-bit PCM Codecs as well as to ISDN-Controllers through the IOM-2 interface (slave only)
·CVSD/PCM converter supporting one bidirectional audio connection General-Purpose Hardware Peripherals
·12-bit A/D Converter (ADC)
·Dual 16-bit Multi-Function Timer (MFT)
·Versatile Timer Unit with four subsystems (VTU)
·Four-channel DMA controller
·Timing and Watchdog Unit
·Random Number Generator peripheral
Extensive Power and Clock Management Support
·On-chip Phase Locked Loop
·Support for multiple clock options
·Dual clock and reset
·Power-down modes
·Up to 56 general-purpose I/O pins (shared with on-chip
peripheral I/O)
·Programmable I/O pin characteristics: TRI-STATE output, push-pull output, weak pull-up input, high-impedance input
·Schmitt triggers on general-purpose inputs
·Multi-Input Wake-Up (MIWU) capability
Power Supply
·I/O port operation at 2.5V to 3.3V
·Core logic operation at 2.5V
·On-chip power-on reset
Temperature Range
·-40°C to +85°C (Industrial)
Packages
·LQFP-128, LQFP-144
Complete Development Environment
·Pre-integrated hardware and software support for rapid prototyping and production
·Integrated environment
·Project manager
·Multi-file C source editor
·High-level C source debugger
·Comprehensive, integrated, one-stop technical support
Bluetooth Protocol Stack
·Applications can interface to the high-level protocols or directly to the low-level Host Controller Interface (HCI)
·Transport layer support allows HCI command-based interface over UART port
·Baseband (Link Controller) hardware minimizes the bandwidth demand on the CPU
·Link Manager (LM)
·Logical Link Control and Adaptation Protocol (L2CAP)
·Service Discovery Protocol (SDP)
·RFCOMM Serial Port Emulation Protocol
·All packet types, piconet, and scatternet functionality supportedPinout
SpecificationsIf Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications.
Supply voltage (VCC) ..................................................................................TBD
All input and output voltages with respect to GND*.......-0.5V to IOVCC + 0.5V
2 kV
ESD protection level......................................................... (Human Body Model)
Allowable sink/source current per signal pin .......................................±10 mA
Total current into IOVCC pins............................................................... 200 mA
Total current into VCC pins (source) .....................................................200 mA
Total current out of GND pins (sink)...................................................... 200 mA
Latch-up immunity .............................................................................±200 mA
Storage temperature range ................................................-65°C to +150°C
Note: Absolute maximum ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications are not ensured when operating the device at absolute maximum ratings. * The latch-up tolerance on Access Bus pins 14 and 15 exceeds 150mA.
DescriptionThe CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip SRAM and Flash memory provides high computing bandwidth, hardware communications peripherals provide high- I/O bandwidth, and an external bus provides system expandability.
On-chip communications peripherals CP3BT23 include: Bluetooth Lower Link Controller, dual CAN controllers, Microwire/Plus, SPI, ACCESS.bus, quad UART, 12-bit A/D converter, and Advanced Audio Interface (AAI). Additional on-chip peripherals include Random Number Generator (RNG), DMA controller, CVSD/PCM conversion module, Timing and Watchdog Unit, Versatile Timer Unit, Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.
Bluetooth hand-held devices CP3BT23 can be both smaller and lower in cost for maximum consumer appeal. The low voltage and advanced power-saving modes achieve new design points in the trade-off between battery size and operating time for handheld and portable applications.
In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3BT23 is backed up by the software resources designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with a Bluetooth radio transceiver such as
National's LMX5252, the CP3BT23 provides a complete Bluetooth system solution. National Semiconductor offers a complete and industryproven application development environment for CP3BT23 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth Protocol Stack, and Application Software.
CP3BT23 Data Sheet
