CNX72A

Features: Options : 10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no. High Current Transfer Ratio (40% min)Low Saturation Voltage suitable for TTL integrated circuitsHigh Isolation Voltage (5.3kVRMS ,7.5kVPK )ApplicationDC mo...

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SeekIC No. : 004315192 Detail

CNX72A: Features: Options : 10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no. High Current Transfer Ratio (40% min)Low Saturation Vol...

floor Price/Ceiling Price

Part Number:
CNX72A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/21

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Product Details

Description



Features:

Options : 10mm lead spread - add G after part no. Surface mount - add SM after part no. Tape&reel - add SMT&R after part no.
High Current Transfer Ratio (40% min)
Low Saturation Voltage suitable for TTL integrated circuits
High Isolation Voltage (5.3kVRMS ,7.5kVPK )






Application

DC motor controllers
Industrial systems controllers
Signal transmission between systems of different potentials and impedances






Specifications

Storage Temperature ....................-55°C to + 150°C
Operating Temperature .................-55°C to + 100°C
Lead Soldering Temperature
(1/16 inch (1.6mm) from case for 10 secs) ......260°C

Forward Current ..............................................60mA
Reverse Voltage ...................................................6V
Power Dissipation .........................................105mW

Collector-emitter Voltage BVCEO....................... 30V
Collector-base Voltage BVCBO ..........................70V
Emitter-collector Voltage BVECO......................... 6V
Power Dissipation....................................... 160mW

Total Power Dissipation ..............................200mW
(derate linearly 2.67mW/°C above 25°C)






Description

The CNX72A of optically coupled isolator consists of an infrared light emitting diode and a NPN silicon photo transistor in a standard 6 pin dual in line plastic package.






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