Features: ` LOW COST` HIGH CURRENT DENSITY -65% INCREASE COMPARED TO CMR3U SERIES` HIGH PEAK FORWARD SURGE CURRENT (IFSM)` LOW FORWARD VOLTAGE DROP (VF)` GLASS PASSIVATED CHIP` C BEND CONSTRUCTION PROVIDES STRAIN RELIEF WHEN MOUNTED ON PC BOARDSpecifications SYMBOL...
CMR5U-02: Features: ` LOW COST` HIGH CURRENT DENSITY -65% INCREASE COMPARED TO CMR3U SERIES` HIGH PEAK FORWARD SURGE CURRENT (IFSM)` LOW FORWARD VOLTAGE DROP (VF)` GLASS PASSIVATED CHIP` C BEND CONSTRUCTION...
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SYMBOL | CMSH5U-02 | CMSH5U-04 | CMSH5U-06 | CMSH5U-08 | UNITS | ||
Peak Repetitive Reverse Voltage | VRRM | 200 | 400 | 600 | 800 | V | |
DC Blocking Voltage | VR | 200 | 400 | 600 | 800 | V | |
RMS Reverse Voltage | VR(RMS) | 140 | 280 | 420 | 560 | V | |
Average Forward Current(TA=55°C) | IO | 5.0 | A | ||||
Peak Forward Surge Current (8.3ms) | IFSM | 175 | A | ||||
Operating and Storage | |||||||
Junction Temperature | TJ,Tstg | -65to+150 | °C | ||||
Thermal Resistance | JA | 10 | °C/W |