CM900HB-90H

Features: · Low Drive Power· Low VCE(sat)· Super-Fast Recovery Free-Wheel Diode· Isolated Baseplate for Easy Heat SinkingApplication· Traction· Medium Voltage Drives· High Voltage Power SuppliesSpecifications Ratings Symbol CM900HB-90H Units Junction Temperature Tj -40 to 150 °C S...

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SeekIC No. : 004314644 Detail

CM900HB-90H: Features: · Low Drive Power· Low VCE(sat)· Super-Fast Recovery Free-Wheel Diode· Isolated Baseplate for Easy Heat SinkingApplication· Traction· Medium Voltage Drives· High Voltage Power SuppliesSpec...

floor Price/Ceiling Price

Part Number:
CM900HB-90H
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/11

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Product Details

Description



Features:

· Low Drive Power
· Low VCE(sat)
· Super-Fast Recovery Free-Wheel Diode
· Isolated Baseplate for Easy Heat Sinking





Application

· Traction
· Medium Voltage Drives
· High Voltage Power Supplies





Specifications

Ratings Symbol CM900HB-90H Units
Junction Temperature Tj -40 to 150 °C
Storage Temperature Tstg -40 to 125 °C
Collector-Emitter Voltage (VGE = 0V) VCES 4500 Volts
Gate-Emitter Voltage (VGE = 0V) VCES ±20 Volts
Collector Current (Tc = 25°C) IC 900 Amperes
Peak Collector Current(Pulse) ICM 1800* Amperes
Diode Forward Current** (Tc = 25°C) IE 900 Amperes
Diode Forward Surge Current**(Pulse) IEM 1800* Amperes
Maximum Collector Dissipation (Tc = 25°C IGBT Part,Tj <125°C) Pc 10000 Watts
Max. Mounting Torque, M8 Terminal Screws - 115 in-lb
Max. Mounting Torque, M6 Mounting Screws - 53 in-lb
Max. Mounting Torque M4 Auxiliary Terminal Screws - 17 in-lb
Module Weight (Typical) - 2.2 kg
V Isolation (Charged Part to Baseplate, AC 60Hz 1 min.) Viso 6000 Vrms





Description

Powerex IGBTMOD™ Modules are designed for use in switching applications. Each CM900HB-90H module consists of one IGBT Transistor with a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.




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