CM50DY-28H

Input: Standard
NTC Thermistor: No
Mounting Type: Chassis Mount
IGBT Type: -
Configuration: Half Bridge
Series: IGBTMOD™
Manufacturer: Powerex Inc
Current - Collector Cutoff (Max): 1mA
Package / Case: Module
Supplier Device Package: Module
Input Capacitance (Cies) @ Vce: 10nF @ 10V
Current - Collector (Ic) (Max): 50A
Power - Max: 400W
Voltage - Collector Emitter Breakdown (Max): 1400V
Vce(on) (Max) @ Vge, Ic: 4.2V @ 15V, 50A


Features:

·Low Drive Power
· Low VCE(sat)
· Discrete Super-Fast Recovery Free-Wheel Diode
· High Frequency Operation
· Isolated Baseplate for Easy Heat Sinking


Application

·AC Motor Control
· Motion/Servo Control
· UPS
· Welding Power Supplies


Specifications

Ratings	Symbol	CM400HU-24H	Units
Junction Temperature	Tj	-40 to 150	°C
Storage Temperature	Tstg	-40 to 125	°C
Collector-Emitter Voltage (G-E SHORT)	VCES	1400	Volts
Gate-Emitter Voltage (G-E SHORT)	VCES	±20	Volts
Collector Current (Tc = 25°C)	IC	50	Amperes
Peak Collector Current	ICM	100*	Amperes
Emitter Current** (Tc = 25°C)	IE	50	Amperes
Peak Emitter Current**	IEM	100*	Amperes
Maximum Collector Dissipation (Tc = 25°C, Tj 125°C))	Pc	400	Watts
Mounting Torque, M5 Main Terminal	-	1.47~1.96	N.m
Mounting Torque, M6 Mounting	-	1.96~2.94	N.m
Weight	-	190	Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.)	Viso	2500	Vrms

Description

Mitsubishi IGBT Modules CM50DY-28H are designed for use in switching applications. Each module consists of two IGBTs in a half-bridge configuration with each transistor having a reverse-connected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.


Parameters:

Technical/Catalog Information	CM50DY-28H
Vendor	Powerex Inc
Category	Discrete Semiconductor Products
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	CM50DY 28H CM50DY28H