CM400HA-24

Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery Free-Wheel Diode· High Frequency Operation· Isolated Baseplate for Easy Heat SinkingApplication·AC Motor Control· Motion/Servo Control· UPS·Welding Power SuppliesSpecifications Ratings Symbol ...

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SeekIC No. : 004314581 Detail

CM400HA-24: Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery Free-Wheel Diode· High Frequency Operation· Isolated Baseplate for Easy Heat SinkingApplication·AC Motor Control· Motion/Servo...

floor Price/Ceiling Price

Part Number:
CM400HA-24
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/28

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Product Details

Description



Features:

· Low Drive Power
· Low VCE(sat)
· Discrete Super-Fast Recovery Free-Wheel Diode
· High Frequency Operation
· Isolated Baseplate for Easy Heat Sinking



Application

·AC Motor Control
· Motion/Servo Control
· UPS
·Welding Power Supplies



Specifications

Ratings Symbol CM900HB-90H Units
Junction Temperature Tj -40 to 150 °C
Storage Temperature Tstg -40 to 125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1200 Volts
Gate-Emitter Voltage(G-E SHORT) VCES ±20 Volts
Collector Current(Tc = 25°C) IC 400 Amperes
Peak Collector Current(Tj 150°C) ICM 800* Amperes
Emitter Current** (Tc = 25°C) IF 400 Amperes
Peak Emitter Current** IFM 800* Amperes
Maximum Collector Dissipation (Tc = 25°C) Pc 2800 Watts
Mounting Torque, M6 Main Terminal - 1.96~2.94 N ` m
Mounting Torque, M6 Mounting - 1.96~2.94 N ` m
Mounting Torque, M4 Terminal - 0.98~1.47 N ` m
Weight - 400 Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) Viso 2500 Vrms



Description

Mitsubishi IGBT Modules CM400HA-24 are designed for use in switching applications. Each module consists of one IGBT in a single configuration with a reverse-connected super- fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.


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