CM1630

• Four, six and eight channels of EMI filtering with integrated ESD protection
• Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
• ±15kV ESD protection on each channel(IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Greater than 25dB attenuation (typical) at 1 GHz
• UDFN package with 0.40mm lead pitch:
  • 4-ch. = 8-lead UDFN
  • 6-ch. = 12-lead UDFN
  • 8-ch. = 16-lead UDFN
• Tiny UDFN package size:
  • 8-lead: 1.7mm x 1.35mm x 0.5mm
  • 12-lead: 2.5mm x 1.35mm x 0.5mm
  • 16-lead: 3.3mm x 1.35mm x 0.5mm
• Increased robustness against vertical impacts during manufacturing process
• Lead-free finishing

The CM1630 is a family of pi-style EMI filter arrays with ESD protection, which integrates four, six and eight filters (C-R-C) in small form factor UDFN 0.40mm pitch packages. The CM1630 has component values of 8.5pF-100-8.5pF per channel. The CM1630 has a cut-off frequency of 200MHz and can be used in applications with data rates up to 80Mbps. The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV.

These devices are particularly well-suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of their small package and easy-to-use pin assignments. In particular, the CM1630 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets.

The CM1630 is housed in space-saving, low-profile 8-, 12- and 16-lead UDFN packages with a 0.4mm pitch and is available with lead-free finishing. This new small UDFN package provides up to 42% board space savings vs. the 0.50mm pitch UDFN packages.