Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery (70ns) Free-Wheel Diodes· High Frequency Operation (20-25 kHz)· Isolated Baseplate for Easy Heat SinkingApplication· AC Motor Control· Motion/Servo Control· General Purpose Inverters· RoboticsSpecifications Characteristic...
CM15MD-12H: Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery (70ns) Free-Wheel Diodes· High Frequency Operation (20-25 kHz)· Isolated Baseplate for Easy Heat SinkingApplication· AC Motor ...
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Characteristics |
Symbol |
CM15MD-12H |
Units |
Power Device Junction Temperature |
Tj |
-40 to 150 |
|
Storage Temperature |
Tstg |
-40 to 125 |
|
Mounting Torque, M4 Mounting Screws |
- |
13 |
in-lb |
Module Weight (Typical) |
- |
60 |
Grams |
Isolation Voltage, AC 1 minute, 60Hz |
VRMS |
2500 |
Volts |
Converter Part | |||
Repetitive Peak Reverse Voltage |
VRRM |
800 |
Volts |
Recommended AC Input Voltage |
Ea |
220 |
Volts |
DC Output Current |
IO |
15 |
Amperes |
Surge (Non-repetitive) Forward Current |
IFSM |
150 |
Amperes |
I2t for Fusing |
I2t |
93 |
A2s |
IGBT Inverter Part | |||
Collector-Emitter Voltage (G-E Short) |
VCES |
600 |
Volts |
Gate-Emitter Voltage (C-E Short) |
VGES |
±20 |
Volts |
Collector Current |
IC |
15 |
Amperes |
Collector Current (Pulse)* |
ICM |
30 |
Amperes |
Emitter Current** |
IE |
15 |
Amperes |
Emitter Current** (Pulse)* |
IEM |
30 |
Amperes |
Maximum Collector Dissipation |
PC |
45 |
Watts |
Brake Part | |||
Collector-Emitter Voltage (G-E Short) |
VCES |
600 |
Volts |
Gate-Emitter Voltage (C-E Short) |
VGES |
±20 |
Volts |
Collector Current |
IC |
15 |
Amperes |
Collector Current (Pulse)* |
ICM |
30 |
Amperes |
Collector Dissipation |
PC |
45 |
Watts |
Repetitive Peak Reverse Voltage (Clamp Diode Part) |
VRRM |
600 |
Volts |
Forward Current (Clamp Diode Part) |
IFM |
15 |
Amperes |
Powerex CIB Modules are designed for use in switching applications. Each module consists of a three phase diode converter section, a three phase IGBT inverter section and a brake section. All CM15MD-12H components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.