CM1442

• Six and eight channels of EMI filtering with integrated ESD protection
• 0.4mm pitch, 15-bump, 2.360mm x 1.053mm footprint Chip Scale Package (CM1442-06)
• 0.4mm pitch, 20-bump, 3.160mm x 1.053mm footprint Chip Scale Package (CM1442-08)
• Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
• ±15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Greater than 30dB attenuation (typical) at 1 GHz
• Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance
• Optiguard™ coated for improved reliability at assembly
• Lead-free version available

The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters (C-R-C) in Chip Scale Package form factor with 0.40mm pitch. The CM1442 has component values of 15pF-100-15pF per channel. The CM1442 has a cut-off frequency of 120MHz and can be used in applications where the data rates are as high as 48Mbps. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD protection diodes safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV.

CM1442 is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1442 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets.

The CM1442 incorporates Optiguard™ which results in improved reliability at assembly. The CM1442 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving versus competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.