CM1441

• Four channels of EMI filtering with integrated ESD protection
• Four channels of ESD-only protection
• 0.4mm pitch, 15-bump, 2.360mm X 1.053mm footprint Chip Scale Package (CSP)
• Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network
• ±30kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)
• ±30kV ESD protection on each channel (HBM)
• Greater than 35dB attenuation (typical) at 1 GHz
• Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance
• Optiguard™ coated for improved reliability at assembly
• RoHS compliant (lead-free) finishing

The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter with ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter (30pF-100-30pF) which provides greater than 30dB of attenuation in the 800MHz to 2.7GHz frequency range. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). All ESD protection diodes safely dissipate ESD strikes of ±30kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV.

CM1441 is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1441 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets.

The CM1441 incorporates Optiguard™ which results in improved reliability at assembly. The CM1441 is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing. It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up to 28% board space saving vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.