CD74HC08-Q1

Features: `Qualification in Accordance With AEC-Q100†`Qualified for Automotive Applications`Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval`ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C= 200 pF, R = ...

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CD74HC08-Q1 Picture
SeekIC No. : 004311961 Detail

CD74HC08-Q1: Features: `Qualification in Accordance With AEC-Q100†`Qualified for Automotive Applications`Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval`ESD Protec...

floor Price/Ceiling Price

Part Number:
CD74HC08-Q1
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

`Qualification in Accordance With AEC-Q100†
`Qualified for Automotive Applications
`Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval
`ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C= 200 pF, R = 0)
`Buffered Inputs
`Typical Propagation Delay 7 ns at VCC = 5 V, CL = 15 pF, TA = 25°C
`Fanout (Over Temperature Range)
Standard Outputs . . . 10 LSTTL Loads
Bus Driver Outputs . . . 15 LSTTL Loads
`Extended Temperature Performance of 40°C to 125°C
`Balanced Propagation Delay and Transition Times
`Significant Power Reduction, Compared to LSTTL Logic ICs
`2-V to 6-V VCC Operation
`High Noise Immunity NIL or NIH = 30% of VCC at VCC = 5 V
`CMOS Input Compatibility, Il 1 A at VOL,VOH



Specifications

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input clamp current, IIK (VI < 0.5 V or VI > VCC + 0.5 V) (see Note 1) . . . . ±20 mA
Output clamp current, IOK (VO < 0.5 V or VO > VCC + 0.5 V) (see Note 1) . .±20 mA
Continuous output current, IO (VO > 0.5 or VO < VCC + 0.5 V) . . . . . . . . . . .±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, JA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . .180°C/W
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . .  300°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
† Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.




Description

The CD74HC08 logic gates utilize silicon-gate CMOS technology to achieve operating speeds similar to LSTTL gates, with the low power consumption of standard CMOS integrated circuits. CD74HC08-Q1 can drive 10 LSTTL loads.




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