CB35000

Features: ·0.5 micron triple layer metal HCMOS5S process featuring retrograde well technology, low resistance salicided active areas, polysilicide gates and thin metal oxide.·3.3 V optimized transistor with 5 V I/O interface capability·2 - input NAND delay of 210 ps (typ) with fanout = 2.·Broad I/...

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SeekIC No. : 004310826 Detail

CB35000: Features: ·0.5 micron triple layer metal HCMOS5S process featuring retrograde well technology, low resistance salicided active areas, polysilicide gates and thin metal oxide.·3.3 V optimized transis...

floor Price/Ceiling Price

Part Number:
CB35000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

·0.5 micron triple layer metal HCMOS5S process featuring retrograde well technology, low resistance salicided active areas, polysilicide gates and thin metal oxide.
·3.3 V optimized transistor with 5 V I/O interface capability
·2 - input NAND delay of 210 ps (typ) with fanout = 2.
·Broad I/O functionality including LVCMOS, LVTTL, GTL, PECL, and LVDS.
·High drive I/O; capability of sinking up to 48 mA with slew rate control, current spike suppression and impedance matching.
·Generators to support SPRAM, DPRAM, ROM and MULT with BIST options.
·Extensive embedded function library including DSP and ST micros, popular third party micros and Synopsys synthetic libraries.
·Fully independent power and ground configurations for inputs, core and outputs.
·I/O ring capability up to 800 pads.
·Output buffers capable of driving ISA, EISA, PCI, MCA, and SCSI interface levels.
·Active pull up and pull down devices.
· Buskeeper I/O functions.
·Oscillators for wide frequency spectrum.
·Broad range of 300 SSI cells.
·Low Power / Low Drive library subset.
·Design For Test includes IEEE 1149.1 JTAG Boundary Scan architecture built in.
·Cadence and Mentor based design system with interfaces from multiple workstations.
·Broad ceramic and plastic package range.
·Latchup trigger current > +/- 500 mA. ESD protection > +/- 4000 volts.




Specifications

Supply Voltage, Vdd -0.5 V to +6.0 V
Input or Output Voltage -0.5 V to (Vdd + 0.5V)
DC Forward Bias Current, Input or Output -24mA source, +24mA sink
Storage Temperature Ceramic -65 to 150 degrees Centigrade
Storage Temperature Plastic -40 to 125 degrees Centigrade
Note 1. Referenced to Vss. Stresses above those listed under "absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.


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