CA3252

The CA3252 is used to interface low-level logic to high current loads. Each Power Driver has four inverting switches consisting of an inverting logic input stage and an inverting low-side driver output stage. All inputs are 5V TTL/CMOS logic compatible and have a common Enable input. On-chip steering diodes are connected from each output (in pairs) to the CLAMP pins (in pairs) which may be used in conjunction with external zener diodes to protect the IC against over-voltage transients that result from inductive load switching. TheCA3252 may be used in a variety of automotive and industrial control applications to drive relays, solenoids, lamps and small motors.

To allow for CA3252 maximum heat transfer from the chip, all ground pins on the DIP and SOIC packages are directly connected to the mounting pad of the chip. CA3252 Integral heat spreading lead frames directly connect the bond pad and ground leads for good heat dissipation. In a typical application, the package is mounted on a copper PC Board. By increasing copper ground area on the PC Board, more heat is conducted away from the ground leads. The junction-to-ambient thermal resistances may be reduced to less than 40/W with approximately two square inches of copper area.