C86159E-09

Description

C86159E-09 have been designed specifically to meet the demanding requirements of laser initiated ordnance (LIO) applications. C86159E-09 offerings include a 9.0 nm TO-style package and an 8 pin miniDIL pigtailed package equipped with a rear facet monitor photodiode and 100/140 um optical fibre. C86159E-09 980 nm laser chip employs advanced epitaxial materials and processing techniques, providing reliable high optical power output capability and significant power retention at elevated temperatures. Alternate package outlines and fibre-optic core diameters may be considered on a custom basis.