Features: ·Planar Die Construction·Ultra-Small Surface Mount Package·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Rating Unit Power dissipation P 150 mW Thermal Resistance, Junction to Ambient Air RJA 833 /W Forward Voltage @ IF = 10mA VF ...
BZT52C39T: Features: ·Planar Die Construction·Ultra-Small Surface Mount Package·Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Rating Unit Power dissipation P 150 ...
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Parameter | Symbol | Rating | Unit |
Power dissipation | P | 150 | mW |
Thermal Resistance, Junction to Ambient Air | RJA | 833 | /W |
Forward Voltage @ IF = 10mA | VF | 0.9 | V |
Jumction temperature | Tj | 150 | |
Storage temperature | Tstg | -65 to +150 |