Features: · Planar Die Construction· Ultra-Small Surface Mount Package· Ideally suited for Automated Assembly Processes· Also Available in Lead Free VersionSpecifications Characteristic Symbol Value Unit Forward Voltage (Note 2) @ IF = 10mA VF 0.9 V Power Dissipation (Note 1) ...
BZT52C2V0S: Features: · Planar Die Construction· Ultra-Small Surface Mount Package· Ideally suited for Automated Assembly Processes· Also Available in Lead Free VersionSpecifications Characteristic Symbol...
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Characteristic | Symbol | Value | Unit |
Forward Voltage (Note 2) @ IF = 10mA | VF | 0.9 | V |
Power Dissipation (Note 1) | Pd | 200 | mW |
Thermal Resistance, Junction to Ambient Air (Note 1) | RJA | 625 | /W |
Operating and Storage Temperature Range | Tj, TSTG | -65 to +150 |
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used in minimize self-heating effect.
Part Number | BZT52C2V0S |
Power Rating (mW) | 200 |
NomVZ | 2 |
@ IZT (mA) | 5 |
Tol V (typ) (%) | 4.5 |
IR (µA) | 150 |