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BZT52C2V0S

Features: · Planar Die Construction· Ultra-Small Surface Mount Package· Ideally suited for Automated Assembly Processes· Also Available in Lead Free VersionSpecifications Characteristic Symbol Value Unit Forward Voltage (Note 2) @ IF = 10mA VF 0.9 V Power Dissipation (Note 1) ...

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SeekIC No. : 004306764 Detail

BZT52C2V0S: Features: · Planar Die Construction· Ultra-Small Surface Mount Package· Ideally suited for Automated Assembly Processes· Also Available in Lead Free VersionSpecifications Characteristic Symbol...

BZT52C2V0S Data Sheet

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Part Number:
BZT52C2V0S
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/9/27

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Product Details

Description



Features:

· Planar Die Construction
· Ultra-Small Surface Mount Package
· Ideally suited for Automated Assembly Processes
· Also Available in Lead Free Version




Specifications

Characteristic Symbol Value Unit
Forward Voltage (Note 2) @ IF = 10mA VF 0.9 V
Power Dissipation (Note 1) Pd 200 mW
Thermal Resistance, Junction to Ambient Air (Note 1) RJA 625 /W
Operating and Storage Temperature Range Tj, TSTG -65 to +150


Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used in minimize self-heating effect.



Part Number BZT52C2V0S
Power Rating (mW) 200
NomVZ 2
@ IZT (mA) 5
Tol V (typ) (%) 4.5
IR (µA) 150





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