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BZT52C2V0

Features: · Planar Die Construction· 500mW Power Dissipation on Ceramic PCB· General Purpose, Medium Current· Ideally Suited for Automated Assembly Processes· Available in Lead Free VersionSpecifications Part Number BZT52C2V0 Power Rating (mW) 500 NomVZ 2 @ IZT (mA) 5 Tol ...

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SeekIC No. : 004306763 Detail

BZT52C2V0: Features: · Planar Die Construction· 500mW Power Dissipation on Ceramic PCB· General Purpose, Medium Current· Ideally Suited for Automated Assembly Processes· Available in Lead Free VersionSpecifica...

BZT52C2V0 Data Sheet

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Part Number:
BZT52C2V0
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Planar Die Construction
· 500mW Power Dissipation on Ceramic PCB
· General Purpose, Medium Current
· Ideally Suited for Automated Assembly Processes
· Available in Lead Free Version




Specifications

Part Number BZT52C2V0
Power Rating (mW) 500
NomVZ 2
@ IZT (mA) 5
Tol V (typ) (%) 4.5
IR (µA) 150


Characteristic
Symbol
Value
Unit
Forward Voltage (Note 2) @ IF = 10mA
VF
0.9
V
Power Dissipation (Note 1)
Pd
500
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RJA
305
/W
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2.
2. Short duration test pulse used to minimize self-heating effect.




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