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BZD27C3V6P

Features: • Sillicon Planar Zener Diodes• Low profile surface-mount package• Zener and surge current specification• Low leakage current• Excellent stability• High temperature soldering: 260 °C/10 sec. at terminals• Lead (Pb)-free component• Component...

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BZD27C3V6P: Features: • Sillicon Planar Zener Diodes• Low profile surface-mount package• Zener and surge current specification• Low leakage current• Excellent stability• High...

BZD27C3V6P Data Sheet

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Part Number:
BZD27C3V6P
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

• Sillicon Planar Zener Diodes
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
• Excellent stability
• High temperature soldering: 260 °C/10 sec. at terminals
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC




Specifications

Parameter Test condition Symbol Value Unit
Power dissipation TL = 80 °C Ptot 2.3 W
TA = 25 °C Ptot 0.81) W
Non-repetitive peak pulse power
dissipation		 100 µs square pulse2) PZSM 300 W
10/1000 µs waveform (BZD27-
C7V5P to BZD27-C100P)2)		 PRSM 150 W
10/1000 µs waveform (BZD27-
C110P to BZD27-C200P)2)		 PRSM 100 W

1) Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40 µm thick)
2) TJ = 25 °C prior to surge




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