Features: · Low diode capacitance· Low leakage current· SOT665 surface mount package· Common anode configuration.Application· Communication systems· Computers and peripherals· Audio and video equipment.PinoutSpecifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per diode IZ wo...
BZA900AVL: Features: · Low diode capacitance· Low leakage current· SOT665 surface mount package· Common anode configuration.Application· Communication systems· Computers and peripherals· Audio and video equipm...
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SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
Per diode | |||||
IZ | working current | Tamb = 25 °C | - | note 1 | mA |
IF | continuous forward current | Tamb = 25 °C | - | 200 | mA |
IFSM | non-repetitive peak forward current | tp = 1 ms; square pulse | - | 638 | A |
Ptot | total power dissipation | Tamb = 25 °C;note 2; see Fig.5 | - |
335 | mW |
PZSM | non-repetitive peak reverse power dissipation |
square pulse;tp = 1 ms; | - |
6 | W W W |
Tstg | storage temperature | -65 | +150 | °C | |
Tj | junction temperature | - | 150 | °C | |
ESD | electrostatic discharge | IEC 61000-4-2 (contact discharge) | 15 | - | kV |
HBM MIL-Std 883 | 10 | - | kV |