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BY558

Features: * Glass passivated* High maximum operating temperature* Low leakage current* Excellent stability* Also available with preformed leads for easy insertion* Designed to withstand transientsup to 1700 V.Application* For use in multi-sync monitor horizontal deflection circuitsPinoutSpecificat...

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SeekIC No. : 004305365 Detail

BY558: Features: * Glass passivated* High maximum operating temperature* Low leakage current* Excellent stability* Also available with preformed leads for easy insertion* Designed to withstand transientsup...

BY558 Data Sheet

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Part Number:
BY558
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/9/27

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Product Details

Description



Features:

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Also available with preformed leads for easy insertion
* Designed to withstand transients
up to 1700 V.


Application

* For use in multi-sync monitor horizontal deflection circuits


Pinout

Connection Diagram


Specifications

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRSM non-repetitive peak
reverse voltage		 1500 V
VRRM repetitive peak reverse voltage 1500 V
VR continuous reverse voltage 1400 V
I F(AV) average forward current Ttp =65 °C; see Fig.2;
PCB mounting; averaged over any
20 ms period; see Fig.4

85


2.5

 A
I FRM repetitive peak forward current 12 A
IFSM non-repetitive peak forward current t = 10 ms half sinewave;
Tj =Tj max prior to surge;
VR =VRRMmax		 80 A
Tstg storage temperature -65 +175
Tj operating junction temperature -65 +150



Description

Rugged glass package, BY558 using a high temperature alloyed construction.
 
BY558 is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.


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