BUZ45B

Drain to Source Breakdown Voltage (Note 1)  . .  . . .V_DS 500 V
Drain to Gate Voltage (R_GS = 20kΩ) (Note 1) .  . . . V_DGR 500 V
Continuous Drain Current (T_C = 35oC) . . . . .  . . . . . . . I_D 10 A
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . I_DM 40 A
Gate to Source Voltage . . . . . . . . . . . .. . . . . . . . . . .V_GS ±20 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . .  . .P_D 125 W
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . .. . . 1.0 W/^oC
Operating and Storage Temperature . . T_J, T_STG -55 to 150 ^oC
DIN Humidity Category - DIN 40040 . . . . . . . . . . . . . . . . E
IEC Climatic Category - DIN IEC 68-1. .  . . . . . . . . . 55/150/56
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . T_L 260 ^oC
NOTE:
1. T_J = 25^oC to 125^oC.