MOSFET N-CH 200V 9.5A
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Transistor Polarity : | N-Channel | Drain-Source Breakdown Voltage : | 200 V | ||
Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 9.5 A | ||
Resistance Drain-Source RDS (on) : | 0.4 Ohms | Configuration : | Single | ||
Maximum Operating Temperature : | + 150 C | Mounting Style : | Through Hole | ||
Package / Case : | TO-220AB | Packaging : | Tube |
BUZ32 | UNITS | ||
Drain to Source Breakdown Voltage (Note 1) | VDS | 200 | V |
Drain to Gate Voltage (RGS = 20k) (Note 1) | VDGR | 200 | V |
Continuous Drain Current, TC = 55 | ID | 9.5 | A |
Pulsed Drain Current (Note 3) | IDM | 38 | A |
Gate to Source Voltage | VGS | ±20 | V |
Maximum Power Dissipation | PD | 75 | W |
Linear Derating Factor | 0.6 | W/ | |
Operating and Storage Temperature | TSTG, TJ | -55 to 150 | |
DIN Humidity Category - DIN 40040 | E | ||
IEC Climatic Category - DIN IEC 68-1 | 55/150/56 | ||
Leads at 0.063in (1.6mm) from Case for 10s | TL | 300 | |
Package Body for 10s, See Techbrief 334 | Tpkg | 260 |
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Technical/Catalog Information | BUZ32 |
Vendor | Infineon Technologies |
Category | Discrete Semiconductor Products |
Mounting Type | Through Hole |
FET Polarity | N-Channel |
Drain to Source Voltage (Vdss) | 200V |
Current - Continuous Drain (Id) @ 25° C | 9.5A |
Rds On (Max) @ Id, Vgs | 400 mOhm @ 6A, 10V |
Input Capacitance (Ciss) @ Vds | 530pF @ 25V |
Power - Max | 75W |
Packaging | Tape & Reel (TR) |
Gate Charge (Qg) @ Vgs | - |
Package / Case | TO-220AB |
FET Feature | Standard |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | BUZ32 BUZ32 BUZ32IN ND BUZ32INND BUZ32IN |