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BSM254F

Features: · Power module· Half-bridge· FREDFET· N channel· Enhancement mode· Package with insulated metal base plate· Package outline/Circuit diagram: 2a1)Specifications Parameter Symbol Values Unit Collector-emitter voltage VDS 500 V Collector-gate voltage RGS = 20k VDGR ...

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SeekIC No. : 004302188 Detail

BSM254F: Features: · Power module· Half-bridge· FREDFET· N channel· Enhancement mode· Package with insulated metal base plate· Package outline/Circuit diagram: 2a1)Specifications Parameter Symbol Va...

BSM254F Data Sheet

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Part Number:
BSM254F
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· Power module
· Half-bridge
· FREDFET
· N channel
· Enhancement mode
· Package with insulated metal base plate
· Package outline/Circuit diagram: 2a1)


Specifications

Parameter Symbol
Values
 Unit
Collector-emitter voltage VDS
500
 V
Collector-gate voltage RGS = 20k VDGR
500
Gate-emitter voltage VGS
±20
Continuous drain current, TC = 25 ID
35
 A
Pulsed drain current, TC = 25 ID puls
140
Operating and storage temperature range Tj, Tstg
- 55 . + 150
Power dissipation, TC = 25 Ptot
400
 W
Thermal resistance Chip-case Rth JC
0.31
 K/W
Insulation test voltage2), t = 1min. Vis
2500
 Vac
Creepage distance, drain-source -
16
 mm
Clearance, drain-source -
11
DIN humidity category, DIN 40 040 -
F
 -
IEC climatic category, DIN IEC 68-1 -
55/150/56
1) See chapter Package Outline and Circuit Diagrams.
2) Insulation test voltage between drain and base plate referred to standard climate 23/50 in acc. with DIN 50 014, IEC 146, para. 492.1.


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