Features: · TrenchMOS™ technology· Very fast switching· Logic level compatible· Subminiature surface mount package·Gate-source ESD protection diodesApplication· Relay driver·High speed line driver· Logic level translatorPinoutSpecifications SYMBOL PARAMETER CONDITIONS MIN. ...
BSH112: Features: · TrenchMOS™ technology· Very fast switching· Logic level compatible· Subminiature surface mount package·Gate-source ESD protection diodesApplication· Relay driver·High speed line dr...
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VDS |
drain-source voltage (DC) |
Tj = 25 to 150 °C |
60 |
V | |
VDGR |
drain-gate voltage (DC) |
Tj = 25 to 150 °C; RGS = 20 k |
|
60 |
V |
VGS |
gate-source voltage (DC) |
±15 |
V | ||
ID |
drain current (DC) |
Tsp = 25 °C; VGS = 10 V; Figure 2 and 3 |
300 |
mA | |
Tsp = 100 °C; VGS = 10 V; Figure 2 | 190 | mA | |||
IDM |
peak drain current |
Tsp = 25 °C; pulsed; tp 10 s;Figure 3 |
1.2 |
mA | |
Ptot |
total power dissipation |
Tsp = 25 °C; Figure 1 |
0.83 |
W | |
| |||||
|
| ||||
Tstg |
storage temperature |
-65 |
+150 |
°C | |
Tj |
operating junction temperature |
-65 |
+150 |
°C |
N-channel enhancement mode field-effect transistor BSH112 in a plastic package using TrenchMOS™1 technology.
Product availability: BSH112 in SOT23.