Features: · TrenchMOS™ technology· Very fast switching· Low threshold voltage· Subminiature surface mount package.Application·Battery management· High speed switch·Logic level translator.PinoutSpecifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDS drain-s...
BSH111: Features: · TrenchMOS™ technology· Very fast switching· Low threshold voltage· Subminiature surface mount package.Application·Battery management· High speed switch·Logic level translator.Pinou...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VDS |
drain-source voltage (DC) |
25 °C Tj 150 °C |
55 |
V | |
VDGR |
drain-gate voltage (DC) |
25 °C Tj 150 °C; RGS = 20 k |
55 |
V | |
VGS |
gate-source voltage (DC) |
±10 |
V | ||
ID |
drain current (DC) |
Tsp = 25 °C; VGS = 4.5V; Figure 2 and 3 |
335 |
mA | |
Tsp = 100 °C; VGS = 4.5V; Figure 2 |
212 |
mA | |||
IDM |
peak drain current |
Tsp = 25 °C; pulsed; tp 10 s;Figure 3 |
1.3 |
mA | |
Ptot |
total power dissipation |
Tsp = 25 °C; Figure 1 |
0.83 |
W | |
Tstg |
storage temperature |
-65 |
+150 |
°C | |
Tj |
operating junction temperature |
-65 |
+150 |
°C |