Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR·SUPERIOR RELIABILITY AND PERFORMANCE·SURGE OVERLOAD RATING TO 200 AMPS PEAK·IDEAL FOR PRINTED CIRCUIT BOAR...
BSBU-400-1C: Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR·SUPERI...
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