BSBU-400-1C

Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR·SUPERIOR RELIABILITY AND PERFORMANCE·SURGE OVERLOAD RATING TO 200 AMPS PEAK·IDEAL FOR PRINTED CIRCUIT BOAR...

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BSBU-400-1C Picture
SeekIC No. : 004302083 Detail

BSBU-400-1C: Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR·SUPERI...

floor Price/Ceiling Price

Part Number:
BSBU-400-1C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/12/21

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Product Details

Description



Features:

·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: ·Typical < 2%, Max. < 10% of Die Area)
·BUILT-IN STRESS RELIEF MECHANISM FOR
·SUPERIOR RELIABILITY AND PERFORMANCE
·SURGE OVERLOAD RATING TO 200 AMPS PEAK
·IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS



Specifications

  Connection Diagram


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