Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION(Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCESURGE OVERLOAD RATING TO 200 AMPS PEAKIDEAL FOR PRINTED CIRCUIT BOARD APPL...
BRSB-503-1C: Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION(Solder Voids: Typical < 2%, Max. < 10% of Die Area)BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR R...
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Features: PRV Ratings from 50 to 1000 VoltsSurge overload rating to 60 AmpsReliable low cost molde...
Features: PRV Ratings from 50 to 1000 VoltsSurge overload rating to 60 Amps peakReliable low cost ...
Features: VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICALSTRENGTH AND HEAT DISSIPATION(Sold...
PARAMETER (TEST CONDITIONS) |
SYMBOL |
RATINGS |
UNITS | ||||||
Series Number |
SB |
SB |
SB |
SB |
SB |
SB |
SB |
||
Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
VOLTS |
Working Peak Reverse Voltage |
VRWM |
35 |
70 |
140 |
280 |
420 |
560 |
700 | |
Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | |
Average Forward Rectified Current @ TA = 55 °C |
IO |
5 |
AMPS | ||||||
Peak Forward Surge Current. TJ = 150°C 60 Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). |
IFSM |
200 | |||||||
Maximum Forward Voltage (Per Diode) at 5 Amps DC |
VFM |
1.0 (Typical < 0.95) |
VOLTS | ||||||
Maximum Average DC Reverse Current |
IRM |
1 |
mA | ||||||
Typical Thermal Resistance |
RqJA |
17 |
°C/W | ||||||
Minimum Insulation Breakdown Voltage (Circuit to Case) |
VISO |
2500 |
VOLTS | ||||||
Junction Operating Temperature Range |
TJ,TSTG |
-55 to +150 |
°C |