Features: · Especially suitable for applications from 420 nm to 1130 nm· High linearity· TO-18, base plate, transparent epoxy resin lens, with base connectionApplication· Computer-controlled flashes· Photointerrupters· Industrial electronics· For control and drive circuitsSpecifications Beze...
BP103: Features: · Especially suitable for applications from 420 nm to 1130 nm· High linearity· TO-18, base plate, transparent epoxy resin lens, with base connectionApplication· Computer-controlled flashes...
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Thermal Interface Products BOND-PLY 100 TAPE .005" 11x12"
Bezeichnung Description |
Symbol Symbol |
Wert Value |
Einheit Unit |
Betriebs- und Lagertemperatur Operating and storage temperature range |
Top; Tst | 40 ... + 80 | °C |
Löttemperatur bei Tauchlötung Lötstelle ³ 2 mm vom Gehäuse, Lötzeit t £ 5 s Dip soldering temperature, ³ 2 mm distance from case bottom t £ 5 s |
TS | 260 | °C |
Löttemperatur bei Kolbenlötung Lötstelle ³ 2 mm vom Gehäuse, Lötzeit t £ 3 s Iron soldering temperature, ³ 2 mm distance from case bottom t £ 3 s |
TS | 300 | °C |
Kollektor-Emitterspannung Collector-emitter voltage |
VCE | 50 | V |
Kollektorstrom Collector current |
IC | 100 | mA |
Kollektorspitzenstrom, t < 10 ms Collector surge current |
ICS | 200 | mA |
Emitter-Basisspannung Emitter -base voltage |
VEB | 7 | V |
Verlustleistung, TA = 25 °C Total power dissipation |
Ptot | 150 | mW |
Wärmewiderstand Thermal resistan |
RthJA | 500 | K/W |