Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE·SURGE OVERLOAD RATING TO 200 AMPS PEAK·IDEAL FOR PRINTED CIRCUIT BOAR...
BKBL-400-1C: Features: ·VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)·BUILT-IN STRESS RELIEF MECHANISM FOR SUPERI...
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PARAMETER (TEST CONDITIONS) |
SYMBOL |
RATINGS |
UNITS | |||||||
Series Number |
KBL00 |
KBL01 |
KBL02 |
KBL04 |
KBL06 |
KBL08 |
KBL10 |
|||
Maximum DC blocking voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
VOLTS | |
Maximum RMS voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
700 | ||
Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | ||
Average Forward Rectified Current @ TA = 65 |
IO |
4 |
AMPS | |||||||
Peak forward surge current 3 Single 60Hz Half-Sine Wave AMPSSuperimposed on Rated Load (JEDEC Method). TJ = 150 |
IFSM |
200 | ||||||||
Maximum Forward Voltage (Per Diode) at 4 Amps DC |
VFM |
0.95 (Typical < 0.90) |
VOLTS | |||||||
Maximum Average DC Reverse Current@ TA = 25 At Rated DC Blocking Voltage @ TA = 125 |
IRM |
1 50 |
A | |||||||
Typical Thermal Resistance Junction to Lead (Note 1) |
RJA RJL |
19.0 2.4 |
/W | |||||||
Minimum Insulation Breakdown Voltage (Circuit to Case) |
VISO |
2500 |
VOLTS | |||||||
Operating and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |