HEATSINK CPU W/ADHESIVE 1.41"SQ
BDN14-3CB/A01: HEATSINK CPU W/ADHESIVE 1.41"SQ
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Capacitance : | 16.5 pF | Series: | BDN |
Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins | Length: | 1.410" (35.81mm) |
Width: | 1.410" (35.81mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 5.6°C/W @ 400 LFM | Thermal Resistance @ Natural: | 16.2°C/W |
Material: | Aluminum |
Technical/Catalog Information | BDN14-3CB/A01 |
Vendor | CTS Thermal Management Products |
Category | Fans, Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.35" (9mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 5.6°C/W @ 400 LFM |
Outline | 35.81mm x 35.81mm |
Thermal Resistance @ Natural | 16.2°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | BDN14 3CB A01 BDN143CBA01 294 1101 ND 2941101ND 294-1101 |