HEATSINK CPU W/ADHESIVE 1.31"SQ
BDN13-3CB/A01: HEATSINK CPU W/ADHESIVE 1.31"SQ
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Capacitance : | 16.5 pF | Series: | BDN |
Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins | Length: | 1.310" (33.27mm) |
Width: | 1.310" (33.27mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 6.0°C/W @ 400 LFM | Thermal Resistance @ Natural: | 16.1°C/W |
Material: | Aluminum |
Technical/Catalog Information | BDN13-3CB/A01 |
Vendor | CTS Thermal Management Products |
Category | Fans, Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.35" (9mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 6.0°C/W @ 400 LFM |
Outline | 33.27mm x 33.27mm |
Thermal Resistance @ Natural | 16.1°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | BDN13 3CB A01 BDN133CBA01 294 1100 ND 2941100ND 294-1100 |