BDN09-3CB/A01

HEATSINK CPU W/ADHESIVE .91"SQ

product image

BDN09-3CB/A01 Picture
SeekIC No. : 003445048 Detail

BDN09-3CB/A01: HEATSINK CPU W/ADHESIVE .91"SQ

floor Price/Ceiling Price

US $ .93~1.82 / Piece | Get Latest Price
Part Number:
BDN09-3CB/A01
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • 100~500
  • 500~1000
  • 1000~5000
  • Unit Price
  • $1.82
  • $1.64
  • $1.28
  • $1.09
  • $1.02
  • $.93
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/21

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Quick Details

Series: BDN Capacitance : 16.5 pF
Manufacturer: CTS Thermal Management Products Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins Length: 0.910" (23.11mm)
Width: 0.910" (23.11mm) Diameter: -
Height Off Base (Height of Fin): 0.355" (9.02mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 9.6°C/W @ 400 LFM Thermal Resistance @ Natural: 26.9°C/W
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Manufacturer: CTS Thermal Management Products
Type: Top Mount
Series: BDN
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Shape: Square, Pin Fins
Length: 0.910" (23.11mm)
Width: 0.910" (23.11mm)
Height Off Base (Height of Fin): 0.355" (9.02mm)
Thermal Resistance @ Forced Air Flow: 9.6°C/W @ 400 LFM
Thermal Resistance @ Natural: 26.9°C/W
Attachment Method: Thermal Tape, Adhesive (Included)


Parameters:

Technical/Catalog InformationBDN09-3CB/A01
VendorCTS Thermal Management Products
CategoryFans, Thermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.35" (9mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow9.6°C/W @ 400 LFM
Outline23.11mm x 23.11mm
Thermal Resistance @ Natural26.9°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names BDN09 3CB A01
BDN093CBA01
294 1097 ND
2941097ND
294-1097



Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
Static Control, ESD, Clean Room Products
Crystals and Oscillators
Boxes, Enclosures, Racks
Optical Inspection Equipment
View more