HEATSINK CPU W/ADHESIVE .91"SQ
BDN09-3CB/A01: HEATSINK CPU W/ADHESIVE .91"SQ
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Series: | BDN | Capacitance : | 16.5 pF |
Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Pin Fins | Length: | 0.910" (23.11mm) |
Width: | 0.910" (23.11mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 9.6°C/W @ 400 LFM | Thermal Resistance @ Natural: | 26.9°C/W |
Material: | Aluminum |
Technical/Catalog Information | BDN09-3CB/A01 |
Vendor | CTS Thermal Management Products |
Category | Fans, Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.35" (9mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 9.6°C/W @ 400 LFM |
Outline | 23.11mm x 23.11mm |
Thermal Resistance @ Natural | 26.9°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | BDN09 3CB A01 BDN093CBA01 294 1097 ND 2941097ND 294-1097 |