HEADER DUAL 26POS LOW PROFILE
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Series: | BDL | Manufacturer: | Samtec Inc | ||
Connector Type: | Unshrouded | Package / Case : | TD200 | ||
Number of Positions: | 26 | Number of Positions Loaded: | All | ||
Pitch: | 0.100" (2.54mm) | Number of Rows: | 2 | ||
Row Spacing: | 0.100" (2.54mm) | Height Stacking (Mating): | - | ||
Molding Height Above Board: | 0.070" (1.78mm) | Contact Mating Length: | 0.108" (2.75mm) | ||
Mounting Type: | Through Hole | Termination: | Solder | ||
Contact Finish: | Gold | Contact Finish Thickness: | 20µin (0.51µm) | ||
Features: | - | Color: | Black |
Technical/Catalog Information | BDL-113-G-E |
Vendor | Samtec Inc |
Category | Connectors |
Color | Black |
Connector Type | Unshrouded |
Contact Finish | Gold |
Contact Finish Thickness | 20in (0.51m) |
Contact Mating Length | 0.105" (2.67mm) |
Features | - |
Height Above Board | 0.070" (1.78mm) |
Height Stacking (Mating) | - |
Mounting Type | Through Hole |
Number of Contacts Loaded | All |
Number of Positions | 26 |
Number of Rows | 2 |
Packaging | Tube |
Pitch | 0.100" (2.54mm) |
Row Spacing | 0.100" (2.54mm) |
Termination | Solder |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | BDL 113 G E BDL113GE |