BDL-108-G-F

CONN HEADER DUAL 16POS LOW PRO

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BDL-108-G-F Picture
SeekIC No. : 003020694 Detail

BDL-108-G-F: CONN HEADER DUAL 16POS LOW PRO

floor Price/Ceiling Price

US $ 3.56~3.56 / Piece | Get Latest Price
Part Number:
BDL-108-G-F
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • Unit Price
  • $3.56
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/9/26

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Product Details

Quick Details

Series: BDL Manufacturer: Samtec Inc
Connector Type: Unshrouded Package / Case : TD200
Number of Positions: 16 Number of Positions Loaded: All
Pitch: 0.100" (2.54mm) Number of Rows: 2
Row Spacing: 0.100" (2.54mm) Height Stacking (Mating): -
Molding Height Above Board: 0.085" (2.16mm) Contact Mating Length: 0.125" (3.18mm)
Mounting Type: Through Hole Termination: Solder
Contact Finish: Gold Contact Finish Thickness: 20µin (0.51µm)
Features: - Color: Black    

Description

Connector Type: Unshrouded
Number of Positions Loaded: All
Height Stacking (Mating): -
Mounting Type: Through Hole
Termination: Solder
Features: -
Contact Mating Length: 0.125" (3.18mm)
Contact Finish: Gold
Color: Black
Packaging: Tube
Number of Rows: 2
Row Spacing: 0.100" (2.54mm)
Pitch: 0.100" (2.54mm)
Number of Positions: 16
Manufacturer: Samtec Inc
Contact Finish Thickness: 20µin (0.51µm)
Molding Height Above Board: 0.085" (2.16mm)
Series: BDL


Parameters:

Technical/Catalog InformationBDL-108-G-F
VendorSamtec Inc
CategoryConnectors
ColorBlack
Connector TypeUnshrouded
Contact FinishGold
Contact Finish Thickness20in (0.51m)
Contact Mating Length0.122" (3.10mm)
Features-
Height Above Board0.085" (2.16mm)
Height Stacking (Mating)-
Mounting TypeThrough Hole
Number of Contacts LoadedAll
Number of Positions 16
Number of Rows2
PackagingTube
Pitch0.100" (2.54mm)
Row Spacing0.100" (2.54mm)
TerminationSolder
Other Names BDL 108 G F
BDL108GF



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