BBL-111-T-F

CONN HEADR LOPRO 11POS .100 TIN

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BBL-111-T-F Picture
SeekIC No. : 003020958 Detail

BBL-111-T-F: CONN HEADR LOPRO 11POS .100 TIN

floor Price/Ceiling Price

Part Number:
BBL-111-T-F
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Quick Details

Series: BBL Manufacturer: Samtec Inc
Connector Type: Unshrouded Package / Case : DD151
Number of Positions: 11 Number of Positions Loaded: All
Pitch: 0.100" (2.54mm) Number of Rows: 1
Row Spacing: - Height Stacking (Mating): -
Molding Height Above Board: 0.085" (2.16mm) Contact Mating Length: 0.122" (3.10mm)
Mounting Type: Through Hole Termination: Solder
Contact Finish: Tin Contact Finish Thickness: -
Features: - Color: Black    

Description

Connector Type: Unshrouded
Number of Positions Loaded: All
Number of Rows: 1
Row Spacing: -
Height Stacking (Mating): -
Mounting Type: Through Hole
Termination: Solder
Contact Finish: Tin
Contact Finish Thickness: -
Features: -
Packaging: Bulk
Color: Black
Number of Positions: 11
Pitch: 0.100" (2.54mm)
Manufacturer: Samtec Inc
Series: BBL
Molding Height Above Board: 0.085" (2.16mm)
Contact Mating Length: 0.122" (3.10mm)


Parameters:

Technical/Catalog InformationBBL-111-T-F
VendorSamtec Inc (VA)
CategoryConnectors
ColorBlack
Connector TypeUnshrouded
Contact FinishTin
Contact Finish Thickness-
Contact Mating Length0.122" (3.10mm)
Features-
Height Above Board0.085" (2.16mm)
Height Stacking (Mating)-
Mounting TypeThrough Hole
Number of Contacts LoadedAll
Number of Positions 11
Number of Rows1
PackagingBulk
Pitch0.100" (2.54mm)
Row Spacing-
TerminationSolder
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names BBL 111 T F
BBL111TF
SAM1003 11 ND
SAM100311ND
SAM1003-11



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