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BB303M

Features: · Build in Biasing Circuit; To reduce using parts cost & PC board space.· High forward transfer admittance; (|yfs| = 42 mS typ. at f = 1 kHz)· Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 250V at C=200pF, Rs=0 conditions.· Provide mini mold packages; MPAK-4 (SOT...

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SeekIC No. : 004296775 Detail

BB303M: Features: · Build in Biasing Circuit; To reduce using parts cost & PC board space.· High forward transfer admittance; (|yfs| = 42 mS typ. at f = 1 kHz)· Withstanding to ESD; Build in ESD absorbi...

BB303M Data Sheet

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Part Number:
BB303M
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

· Build in Biasing Circuit; To reduce using parts cost & PC board space.
· High forward transfer admittance;
    (|yfs| = 42 mS typ. at f = 1 kHz)
· Withstanding to ESD;
    Build in ESD absorbing diode. Withstand up to 250V at C=200pF, Rs=0 conditions.
· Provide mini mold packages; MPAK-4 (SOT-143 var.)


Specifications

Item
Symbol
Ratings
Unit
Drain to source voltage
VDS
7
V
Gate1 to source voltage
VG1S
0/ +7
V
Gate 2 to source voltage
VG2S
0/ +7
V
Drain current
ID
25
mA
Channel power dissipation
Pch
150
mW
Channel temperature
Tch
150
°C
Storage temperature
Tstg
55 to +150
°C



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