BB1110RC

Features: • Integrated resistor and capacitor network• High density packaging• High temperature solder balls• Industry standard ball diameter and pitch• Excellent high frequency performanceDescriptionModel BB1110RC is designed for terminating high-speed memory buses. ...

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SeekIC No. : 004296711 Detail

BB1110RC: Features: • Integrated resistor and capacitor network• High density packaging• High temperature solder balls• Industry standard ball diameter and pitch• Excellent high ...

floor Price/Ceiling Price

Part Number:
BB1110RC
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• Integrated resistor and capacitor network
• High density packaging
• High temperature solder balls
• Industry standard ball diameter and pitch
• Excellent high frequency performance



Description

Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip chip attachment. Their unique construction yields extremely low capacitance and inductance parasitics critical for these high-speed applications.




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