Specifications Parameter Symbol Values Unit Mean forward currentSoldering point, TS = 80 °C, D = 0.5 IFAV 3.5 A RMS forward current IFRMS 5.5 Surge forward currentTJ = 100 °C, 50-Hz sine halfwave, aperiodic IFSM 15 Repetitive peak forward currentTJ = ...
BAX280: Specifications Parameter Symbol Values Unit Mean forward currentSoldering point, TS = 80 °C, D = 0.5 IFAV 3.5 A RMS forward current IFRMS 5.5 Surge forward curr...
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Parameter |
Symbol |
Values |
Unit |
Mean forward current Soldering point, TS = 80 °C, D = 0.5 |
IFAV |
3.5 |
A |
RMS forward current |
IFRMS |
5.5 | |
Surge forward current TJ = 100 °C, 50-Hz sine halfwave, aperiodic |
IFSM |
15 | |
Repetitive peak forward current TJ = 100 °C, tp £ 10 ms |
IFRM |
35 | |
i2t value, TJ = 100 °C, tp = 10 ms |
i2dt |
1.1 |
A2s |
Repetitive peak reverse voltage |
VRRM |
1000 |
V |
Surge peak reverse voltage |
VRSM |
1000 | |
Max. power dissipation, Soldering point TS = 80 °C Ambient TA = 25 °C |
Ptot |
10 1.8 |
W |
Operating and storage temperature range |
Tj, Tstg |
40 . + 150 |
°C |
Thermal resistance, chip-ambient |
RthJA |
70.0 |
K/W |
Thermal resistance, chip soldering point |
RthJS |
7.0 | |
DIN humidity category, DIN 40 040 |
E |
||
IEC climatic category, DIN IEC 68-1 |
40/150/56 |