BAR63-02V E6327

The BAR63-02V E6327  is one member of the BAR63 series.It has the following features including PIN diode for high speed switching of RF signals;Very low forward resistance (low insertion loss);Very low capacitance (high isolation);For frequencies up to 3GHz.

Standard deviation and typical data as measured in the test circuit of Figure 1. Data based on 500 part sample size from 3 wafer lots. 2. Typical data computed from S-parameter and noise parameter data measured in a 50 system. 3. Vd = total device voltage = Vdg 4. Bypass mode voltages shown are used in production test. For source resistor biasing, Bypass mode is set by opening the source resistor. When RST is driven high, the value on ROMA07 C ROMA00 is latched into the board configuration register in the TI380PCIA configuration space. The value on ROMA07 C ROMA00 can be provided by pullup and pulldown resistors that do not affect operation after reset. This feature allows designers to support jumpers or board stuffing options that can be sensed by software that reads the board configuration register. If pullup and pulldown resistors are not used, the contents of the board configuration register are undefined after reset.To fully enhance the external N-channel switches, internal charge pumps are used to boost the output gate drive to approximately 2.5 times the supply voltage, or 7.25V, whichever is less. A feedback network is used to regulate the output gate drive. This keeps the supply current low in addition to providing a maximum output voltage limit. The reason for the maximum output voltage limit is to avoid switch gate source breakdown due to excessive gate overdrive. 

Temperature sensor ICs like the BAR63-02V-E6327 that sense their own die temperatures must be mounted on or close to the object whose temperature they are intend- ed to measure. Because there is a good thermal path between the SC70 packages metal leads and the IC die, the BAR63-02V-E6327 can accurately measure the temper- ature of the circuit board to which it is soldered. If the sensor is intended to measure the temperature of a heat-generating component on the circuit board, it should be mounted as close as possible to that compo- nent and should share supply and ground traces (if they are not noisy) with that component where possible. This maximizes the heat transfer from the component to the sensor.