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B2S-T3

Features: Glass Passivated Die ConstructionLow Forward Voltage DropHigh Current CapabilityHigh Surge Current Capability Designed for Surface Mount Application Plastic Material UL Recognition Flammability Classification 94V-OSpecifications Characteristic Symbol B1S B2S B4S B6S B8S Unit...

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SeekIC No. : 004294009 Detail

B2S-T3: Features: Glass Passivated Die ConstructionLow Forward Voltage DropHigh Current CapabilityHigh Surge Current Capability Designed for Surface Mount Application Plastic Material UL Recognition Flamma...

B2S-T3 Data Sheet

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Part Number:
B2S-T3
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

Glass Passivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material UL Recognition Flammability Classification 94V-O


Specifications

Characteristic Symbol B1S B2S B4S B6S B8S Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 100 200 400 600 800 V
RMS Reverse Voltage VR(RMS) 70 140 280 420 560 V
Average Rectified Output Current @TA = 40°C IO 0.5 A
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)		 IFSM 30 A
I2t Rating for Fusing (t < 8.35ms) I2t 10 A2s
Forward Voltage per element @IF = 0.5A VFM 1.0 V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 125°C		 IRM 5.0
500		 A
Typical Junction Capacitance (per leg) (Note 1) Cj 25 pF
Typical Thermal Resistance (per leg) (Note 2) RJA 85 K/W
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C

1. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
2. Thermal resistance junction to ambient mounted on PC board with 13mm2 copper pads.


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