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B260/A

Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionIdeally Suited for Automatic AssemblyLow Power Loss, High EfficiencySurge Overload Rating to 50A PeakFor Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection ApplicationHigh Temperatu...

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SeekIC No. : 004293974 Detail

B260/A: Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionIdeally Suited for Automatic AssemblyLow Power Loss, High EfficiencySurge Overload Rating to 50A PeakFor Use in Low...

B260/A Data Sheet

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Part Number:
B260/A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

 Schottky Barrier Chip
 Guard Ring Die Construction for Transient Protection
 Ideally Suited for Automatic Assembly
 Low Power Loss, High Efficiency
 Surge Overload Rating to 50A Peak
 For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application
High Temperature Soldering: 260°C/10 Second at Terminal
Plastic Material - UL Flammability Classification 94V-0


Specifications

Characteristic Symbol B220/A B230/A B240/A B250/A B260/A Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 20 30 40 50 60 V
RMS Reverse Voltage VR(RMS) 14 21 28 35 42 V
Average Rectified Output Current @ TT = 100 IO 2.0 A
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
(JEDEC Method)		 IFSM 50 A
Forward Voltage @ IF = 2.0A VFM 0.50 0.70 V
Peak Reverse Current
at Rated DC Blocking Voltage		 @TA = 25
@ TA = 100		 IRM 0.5
20		 mA
Typical Junction Capacitance (Note 2) Cj 200 pF
Typical Thermal Resistance, Junction to Terminal RJT 20 K/W
Typical Thermal Resistance, Junction to Ambient (Note 1) RJA 25 K/W
Operating and Storage Temperature Range Tj, TSTG -65 to +150  

1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.


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