B1006

Features: ·High Dynamic Range/Positive Gain Slope·Excellent LO Driver/Buffer Amplifier·Low Noise or Power Bias Configurations·21.0 dB Small Signal Gain·3.2 dB Noise Figure at Low Noise Bias·+15 dBm P1dB Compression Point at Power Bias·100% On-Wafer RF, DC and Noise Figure Testing·100% Visual Inspe...

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SeekIC No. : 004293622 Detail

B1006: Features: ·High Dynamic Range/Positive Gain Slope·Excellent LO Driver/Buffer Amplifier·Low Noise or Power Bias Configurations·21.0 dB Small Signal Gain·3.2 dB Noise Figure at Low Noise Bias·+15 dBm ...

floor Price/Ceiling Price

Part Number:
B1006
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·High Dynamic Range/Positive Gain Slope
·Excellent LO Driver/Buffer Amplifier
·Low Noise or Power Bias Configurations
·21.0 dB Small Signal Gain
·3.2 dB Noise Figure at Low Noise Bias
·+15 dBm P1dB Compression Point at Power Bias
·100% On-Wafer RF, DC and Noise Figure Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd) +6.0 VDC
Supply Current (Id) 120 mA
Gate Bias Voltage (Vg) +0.3 VDC
Input Power (Pin) 5 dBm
Storage Temperature (Tstg) -65 to +165
Operating Temperature (Ta) -55 to MTT Table5
Channel Temperature (Tch) MTT Table5
(5) Channel temperature affects a device's MTBF. It is recommended to keep channel temperature as low as possible for maximum life.


Description

Mimix Broadband's three stage 18.0-38.0 GHz GaAs MMIC buffer amplifier B1004-BD has a small signal gain of 21.0 dB with a positive gain slope, and a noise figure of 3.2 dB across the band. This MMIC uses Mimix Broadband's 0.15 m GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip B1004-BD has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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