B048K480T30

Features: • 48 V to 48 V V•I Chip Converter• 300 Watt (450 Watt for 1 ms)• High density 1218 W/in3• Small footprint 280 W/in2• Low weight 0.5 oz (14 g)• ZVS/ZCS isolated Sine Amplitude Converter• Typical efficiency 96%• 125°C operation•...

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SeekIC No. : 004293576 Detail

B048K480T30: Features: • 48 V to 48 V V•I Chip Converter• 300 Watt (450 Watt for 1 ms)• High density 1218 W/in3• Small footprint 280 W/in2• Low weight 0.5 oz (14 g)• ...

floor Price/Ceiling Price

Part Number:
B048K480T30
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• 48 V to 48 V V•I Chip Converter
• 300 Watt (450 Watt for 1 ms)
• High density 1218 W/in3
• Small footprint 280 W/in2
• Low weight 0.5 oz (14 g)
• ZVS/ZCS isolated Sine Amplitude Converter
• Typical efficiency 96%
• 125°C operation
• <1 s transient response
• 3.5 million hours MTBF
• No output filtering required
• Surface mount BGA or J-Lead packages



Description

The V•I Chip Bus Converter Module (BCM) B048K480T30 is a high efficiency (>96%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 38.0 V to 55.0 V secondary.The BCM may be used to power non-isolated POL converters or as an independent 38.0 55.0 V source.Due to the fast response time and low noise of the BCM B048K480T30, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced-or eliminated-resulting in savings of board area, materials and total system cost.

The BCM B048K480T30 achieves a power density of 1218 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its V•I Chip power package is compatible with onboard or inboard surface mounting.The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K480T30 does not require a discrete heat sink in typical applications. Low junction to case and junction to lead thermal impedances assure low junction temperatures and long life in the harshest environments.


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