B048K120T15

Features:

• 48V to 12V V•I Chip Converter
• 150 Watt (225 Watt for 1 ms)
• High density up to 600 W/in3
• Small footprint 150 W/in2
• Low weight 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• <1 s transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I ChipBGA package


Specifications

Parameter	Values	Unit	Notes
+In to -In	-1.0 to 60.0	Vdc
+In to -In	100	Vdc	For 100 ms
PC to -In	-0.3 to 7.0	Vdc
TM to -In	-0.3 to 7.0	Vdc
SG to -In	500	mA
+Out to -Out	-0.5 to 15.0	Vdc
Isolation voltage	1500	Vdc	Input to Output
Operating junction temperature	-40 to 125	°C	See note 2
Output current	12.5	A	Continuous
Peak output current	18.7	A	For 1 ms
Case temperature during reflow	208	°C
Storage temperature	-40 to 150	°C
Output power	150	W	Continuous
Peak output power	225	W	For 1 ms

Description

The V•I Chip Bus Converter Module (BCM) B048K120T15 is a high efficiency (>96%),narrow input range Voltage Transformation Module (VTM) operating from a pre regulated 48 Vdc primary bus to deliver an isolated 12 V secondary for Intermediate Bus Architecture applications. The BCM may be used to power non isolated POL converters or as an independent 12 V source. Due to the fast response time and low noise of the BCM B048K120T15, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced-or eliminated-resulting in savings of board area, materials and total systemcost.

The BCM B048K120T15 achieves a power density of 600 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its V•I Chip power BGA package is compatible with on-board or in-board surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance.Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K120T15 does not require a discrete heat sink in typical applications. It is also compatible with heat sink options,assuring low junction temperatures and long life in the harshest environments.