B048K060T24

Features: • 48 V to 6 V V•I Chip Converter• 240 Watt (360 Watt for 1 ms)• High density 974 W/in3• Small footprint 220 W/in2• Low weight 0.5 oz (14 g)• ZVS/ZCS isolated sine amplitude converter• Typical efficiency 95%• 125°C operation• ...

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SeekIC No. : 004293569 Detail

B048K060T24: Features: • 48 V to 6 V V•I Chip Converter• 240 Watt (360 Watt for 1 ms)• High density 974 W/in3• Small footprint 220 W/in2• Low weight 0.5 oz (14 g)• ZV...

floor Price/Ceiling Price

Part Number:
B048K060T24
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Description



Features:

• 48 V to 6 V V•I Chip Converter
• 240 Watt (360 Watt for 1 ms)
• High density 974 W/in3
• Small footprint 220 W/in2
• Low weight 0.5 oz (14 g)
• ZVS/ZCS isolated sine amplitude converter
• Typical efficiency 95%
• 125°C operation
• <1 s transient response
• 3.5 million hours MTBF
• No output filtering required
• Surface mount BGA or J-Lead packages



Specifications

Parameter Values Unit Notes
+In to -In -1.0 to 60 Vdc  
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc  
+Out to -Out -0.5 to 15.0 Vdc  
Isolation voltage 2,250 Vdc Input to Output
Output current 42.4 A Continuous
Peak output current 60.0 A For 1 ms
Output power 240 W Continuous
Peak output power 360 W For 1 ms
Case temperature 208 °C During reflow
Operating junction temperature(1) -40 to 125 °C T - Grade
-55 to 125 °C M - Grade
Storage temperature -40 to 150 °C T - Grade
-65 to 15 °C M - Grade



Description

The V•I Chip Bus Converter Module (BCM) B048K060T24 is a high efficiency (>95%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 4.75 V to 6.87 V secondary.The BCM may be used to power non-isolated POL converters or as an independent 4.75 6.87 V source.Due to the fast response time and low noise of the BCM B048K060T24, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced-or eliminated-resulting in savings of board area, materials and total system cost.

The BCM B048K060T24 achieves a power density of 974 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its V•I Chip power package is compatible with onboard or inboard surface mounting.The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K060T24 does not require a discrete heat sink in typical applications. It is also available with heat sink options, assuring low junction temperatures and long life in the harshest environments.


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