AWT6314

The AWT6314R meets the increasing demands for higher levels of integration in dual-band CDMA/PCS 1X handsets, while reducing board area requirements by 25 %. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a common VMODE pin. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and shutdown mode with low leakage current, serve to increase handset talk and standby time. The self contained 3 mm x 5 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 system.